Yinglong Superhard Materials Manufactory
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YingLong Superhard Materials Manufactory

Add: Lintong District, Xi'an, China

Tel: +86-29-63354776/63354775

Fax: +86-29-63354775/83852230

Skype: HeroHome-Sunny

Email: Info@HeroHomecn.com

Export@herohomecn.com

Tech@herohomecn.com

Back Grinding Wheel for Sapphire Thinning

Back Grinding Wheel for Sapphire Thinning

General Information;
 In Front of the Original Semiconductor Processing, Grinding, Thinning and Polishing of the Wafer Substrate, a Wide Variety of Diamond Grinding Wheel would be Used for Back Grinding & Processing the Grinding Wheel.

Based on Various Types of Wafer Materials, like Sapphire Substrate, SiC Substrate, GaAs Substrate, Silicon Substrate, Different Diamond Grinding Wheels would be Chosen, such as Diamond Vitrified Grinding Wheels, Metal Grinding Wheels, Resin Grinding Wheels.

 In the Process of Machining, “HeroHome” Diamond Grinding Wheels are with Long Life, Advantageous Grinding and Thinning Result, Great Extent to Meet the Industry Machining Accuracy and Surface Finish Requirements for Optical Industry and Solve the Weakness of Machining Scratches on the Wafer Surface.

Regular Size of Grinding Wheels of Sapphire Grinding & Thinning;

Item

Size(MM)

Abrasive

Grain Size

Bond

Usage

Back Grinding Wheel

 for Thinning Sapphire 

D150*M12*T28*W15*X6

Diamond

240#/280#

Or as the requirement of customer

Resin 

Metal 

Vitrified 

For thinning the Sapphire, 

Silicon, GaAs Substrate

D202*H30*T20 with Groove

D209*H158*T23.3

D250/252*H28*T46

D255*H92*T45

D265*H28*T43.6

D302*H110*T35

D358*H120*T68

The Grinding Wheels could be also be produced as customers’ requirement.

Contact us:

Tel: +0086-29-62821158 62821168 83851636 83855677

Fax: +0086-29-62821168 83852230

Email: YingLong@cnHeroHome.com YingLong@Grinding-Wheel.net